The ZP07 series combines high cutting ability that is specific to electroformed bond blades and appropriate self sharpening ability by forming pores in the electroformed bond. It is now possible to process silicon + glass, silicon carbide (SiC) and other materials that have been difficult to cut with conventional electroformed bonds.
Reallizes one-pass processing of glass + Silicon wafer
Realizes high-quality processing of silicon carbide (SiC) and other difficult-to-cut materials.
Two types available: standard and low concentration.
For the detailed specification and functions, view our catalogues.