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Applications Support

Applications Expertise in Kiru (cutting), Kezuru (grinding), Migaku (polishing)
We believe that what our customers really want is not just the products that DISCO supplies but the processing results derived from using our products as a means to an end. Based on this idea, we provide the processing know-how (application technology) related to Kiru (cutting), Kezuru (grinding) and Migaku (polishing) accumulated over a long period of time as the best processing results through free-of-charge processing tests (test cuts).
The test cut support reinforces the trusting relationships with our customers and at the same time brings out further advanced expertise to draw on, including the process leading to these results. Such accumulation of know-how is what sustains our response toward highly-advance inquires from our customers.
Applications Example
Applications R&D Labs Around the Globe
The DISCO Head Office Applications R&D Laboratory, respected throughout the industry, features 35 machines, over 3,000 different diamond products, and 50 highly skilled applications engineers. This large and central lab handles test requests from around the world, while local facilities in Japan (Sendai, Osaka, and Kumamoto) and the US, Germany, Singapore, and China let customers participate in research at locations convenient to them.

Customers use DISCO's applications facilities in a variety of ways. Some ship their wafers or other workpieces, letting DISCO investigate and select the optimum machines, abrasive tools, and processing conditions for the job. Many customers, however, take advantage of DISCO's open doors and visit the labs themselves, working closely with DISCO's engineers to create new processes and solutions.

In fact, many manufacturers consult DISCO Applications R&D at the design stage of a new product. DISCO's engineers are eager to participate in such research, as DISCO seeks always to be the first point of contact for any Kiru, Kezuru, Migaku need.
Your Nearest DISCO Office

Available Equipment
This introduces the equipment that will be used for test cuts at the Applications Labs of DISCO worldwide affiliate offices. It is also possible to do test cuts with machines that are not shown here. And at the DISCO Corporation (Tokyo), DISCO HI-TEC SINGAPORE (Singapore) and DISCO HI-TEC EUROPE (Munich), test cuts with some equipment can be conducted in a clean room. For details, please contact your DISCO sales representative.

Machine Models Used in Applications Support
DISCO Corporation (Tokyo)
Laser Saws Dicing Saws Grinders Polishers Related Equipment
DFL7160 (Fullcut/
DAD322, DAD3220, DAD3230, DAD3430, DAD3350, DAD361, DAD3650, DFD6240, DFD6340(Fullcut/Halfcut), DFD6360(Halfcut), DFD6361(Fullcut/Halfcut), DFD6450,DFD651 DAG810, DFG8540, DFG8560, DFG8540 DBG ver. DFP8140, DGP8760, DGP8761 For details, please contact your DISCO sales representative.
Laser Saws Dicing Saws Grinders Polishers Related Equipment
DFL7360 DAD3220, DFD6362, DAD3350, DFD6340 DAG810, DFG8540 DFP8140, DGP8760+
DCS1410, DWR1720
Laser Saws Dicing Saws Grinders Polishers Related Equipment
DFL7160 (Fullcut/
DFD6340, DFD6361 (Half Cut/Full Cut) DAG810 (TAIKO and Package Grinding) DGP8761 CMP,
Co2 Bubbler, StayClean & StayClean injector, Backgrind waste water treatment plant for ISO14000., SEM
Laser Saws Dicing Saws Grinders Polishers Related Equipment
DFL7340, DAL7020 DFD6362, DAD3350, DAD322 - DGP8760+
Laminator (12 inch), UV Irradiator, DWR1720x 2, Co2 Bubbler, StayClean & StayClean injector
Laser Saws Dicing Saws Grinders Polishers Related Equipment
DFL7560L DFD6361, DFD6560, DAD3650 - DGP8761+
BG Tape Laminator
RAD3510 (8, 12in)
UV irradiator (Max 12in)
CC filter unit
Laser Saws Dicing Saws Grinders Polishers Related Equipment
DFL7340 DFD6362 (12 inch), DFD6360 (12 inch), DFD6340 x 2 units, DAD3350 DFG8540+Dry Etcher, DAG810 (Possible for TAIKO Process), DAG810 (Possible for 12 inch) DFP8140, DGP8760 Mounter x 2 units (for 8, 12 inch), Laminator (4 - 8 inch), UV Irradiator (4 - 12 inch), DCS1440, Expander (8 inch), DWR1720

Kiru, Kezuru, Migaku Topics
Applications Example
DISCO Technical Review
Solutions Support

KABRA Used semiconductor equipment
Personal Information Protection Policy
User Agreement
Use of the DISCO Corporate Name
Guarantee policy for customer using DISCO Products
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