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DISCO HOME > Solutions > Kiru, Kezuru, Migaku Topics


Kiru, Kezuru, Migaku Topics

The topics page highlights the latest Kiru, Kezuru and Migaku technologies.
Introducing DISCO's accumulated advanced application technologies in response to customers' needs.
Blade Dicing Laser Dicing Grinding Stress Relief DBG / SDBG Others
Laser dicing is a technology that DISCO has focused on in recent years as a pillar of Kiru technology, alongside blade dicing. Introducing processing technologies that utilize the special characteristics of lasers, such as improved processing speed and cutting of compound material.
Processing Sapphires with Lasers
Stealth Dicing Application
DBG + DAF Laser Cut
Laser Full Cut Dicing
Low-k Grooving

Kiru, Kezuru, Migaku Topics
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