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Kiru, Kezuru, Migaku Topics

The topics page highlights the latest Kiru, Kezuru and Migaku technologies.
Introducing DISCO's accumulated advanced application technologies in response to customers' needs.
Blade Dicing Laser Dicing Grinding Stress Relief DBG / SDBG Others
DBG/SDBG is a process that first half-cuts or stealth-dices the wafer and then separates the die during backside grinding. This is a reverse of the standard process where backside grinding is carried out before wafer cutting. It is capable of significantly lowering the risk of wafer breakage during grinding and handling, and of lowering chipping during die separation.
DBG (Dicing Before Grinding) Process
SDBG (Stealth Dicing Before Grinding) Process

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