The ZHDG series developed for dicing various substrates adopts a larger grit size compared to the hub blades for semiconductor wafers. Also, the abundant concentration lineup responds to various customer requests.
Improved operability thanks to the aluminum base as compared with standard hubless type blades for dicing substrates.
Selectable from a lineup with an abundant variety of grit sizes and concentrations.
Reduction in resin/metal burring by selecting a low concentration.
For the detailed specification and functions, view our catalogues.