The ultra-thin, high-performance NBC-Z series blades are a result of DISCO's original
These blades employ electroformed bonds that realize superb cutting quality and blade life.
In addition to dicing
semiconductor wafers, these blades are suitable for dicing a wide variety of semiconductor packages.
Deep cutting and grooving are possible using ultra-thin blades.
Blade thickness - 0.015 mm to 0.3 mm
Wide range of grit sizes and bond types are available to meet application requirements
Available for both dicing saws and slicers
For the detailed specification and functions, view our catalogues.