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News Releases


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2017
December 11, 2017KABRA!zen Developed: Full-Automatization of KABRA Laser Slicing Technology
December 7, 2017Newly Developed Parallel Processing Transfer System which Realizes Efficient Wafer Processing
Newly Developed Fully Automatic Expander DFX2400 which Supports ø300 mm Wafers and Improves Separation Performance of Small Die Devices
December 6, 2017DFL7362: Stealth Dicing Laser Saw which Achieves Higher Throughput
November 30, 2017The website regarding SEMICON Japan 2017 has been released
November 29, 2017DFD6561: Newly Developed Small-Footprint, Fully-Automatic Dicing Saw which Supports ø300 mm Wafers
November 28, 2017Two Types of New Precision Processing Tools which Support Thinning for Advanced Semiconductor Devices
November 16, 2017DISCO's operations will not be affected by the recent earthquake in Korea.
November 10, 2017Impact on DISCO's Products from Improper Conduct by Kobe Steel, Ltd.
November 8, 2017DISCO's operations will not be affected by the recent heavy rain and flooding in Penang and Malaysia.
October 25, 2017Decision for Further Expansion of Kuwabata Plant in Order to Enhance Production System of Precision Processing Tools
October 8, 2017Earthquake update: Fukushima Prefecture, Japan (Oct 6). Our business is not affected by this earthquake.
September 13, 2017KABRA process website updated.
September 11, 2017Earthquake update: Akita Prefecture, Japan (Sep 8). Our business is not affected by this earthquake.
August 16, 2017The large-scale power outage which occurred in Taiwan on August 15, 2017 will have no impact on DISCO's operations.
July 31, 2017Establishment of Nagano Works Chino Plant
July 18, 2017Exhibition at SEMICON Taiwan 2017 (Sep. 13-15)
Exhibition at IC China 2017 (Oct. 25-27)
July 11, 2017Earthquake update: Kagoshima Prefecture, Japan (Jul 11). Our business is not affected by this earthquake.
July 6, 2017The heavy rain in the Kyushu area will have no impact on our business.
July 3, 2017Earthquake update: Hokkaido Prefecture, Japan (Jul 1). Our business is not affected by this earthquake.
Earthquake update: Kumamoto Prefecture, Japan (Jul 2). Our business is not affected by this earthquake.
June 26, 2017Earthquake update: Nagano Prefecture, Japan (Jun 25). Our business is not affected by this earthquake.
June 22, 2017Exhibition at SEMICON West 2017 (July. 11-13)
June 21, 2017Earthquake update: Oita Prefecture, Japan (Jun 20). Our business is not affected by this earthquake.
May 24, 2017Notice for Change in Role of Managing Director
March 23, 2017Exhibition at SEMICON Southeast Asia 2017 (Apr. 25-27)
Exhibition at FINE CHEMICALS JAPAN (Apr. 19-21)
March 10, 2017DISCO Corporation Receives Intel's Preferred Quality Supplier Award
March 2, 2017Relocation and Reconstruction of Kyushu Branch Office from March 3.
February 28, 2017Earthquake update: Fukushima Prefecture, Japan (Feb. 28). Our business is not affected by this earthquake.
February 22, 2017Exhibition at SEMICON China 2017 (Mar. 14-16)
February 2, 2017DISCO Develops Hub Blades with High Quality-Standards: Sales of “ZH05 Prime Grade” to Be Officially Expanded
January 23, 2017Dedicated Facility for Equipment Operation Training Established in Taiwan Affiliate Office
January 12, 2017Exhibition at SEMICON Korea 2017 (Feb. 8-10)
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