Laser saws make use of the characteristics of lasers to achieve high speed, high accuracy, and high quality processing of composite materials and difficult-to-cut materials.
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Laser processing method introduction |
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| Ablation processing |
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| A processing method for full cutting or full grooving in which solids are vaporized or sublimated by focusing laser energy on an extremely small area for a very short length of time. |
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| Stealth dicing |
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| This is a dicing method that forms a modified layer in the workpiece, by focusing a laser inside the workpiece, and then implements die separation with a machine such as a tape expander. |
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| Laser Lift-off |
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| Detaching the material layer from the substrate by irradiating a laser on the material layer formed on the substrate. |
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DAL7020 |
DFL7020 |
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| Max. Workpiece size |
mm |
ø150 |
| Processing method |
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Automatic |
Fully automatic |
| X-axis |
Max. feed speed |
mm/s |
0.1 - 300 |
| Y-axis |
Positioning accuracy |
mm |
Within 0.003/160 |
| Utilities |
Dimensions (WxDxH) |
mm |
600 x 1,500 x 1,530 |
1,050 x 1,530 x 1,650 |
| Weight |
kg |
Approx. 810 |
Approx. 1,310 |
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DFL7161 |
DFL7160 |
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| Max. Workpiece size |
mm |
ø300 |
| Processing method |
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Fully automatic |
| X-axis |
Max. feed speed |
mm/s |
1.0 - 1,000 |
0.1 - 600 |
| Y-axis |
Positioning accuracy |
mm |
Within 0.003/310 |
| Utilities |
Dimensions (WxDxH) |
mm |
1,560 x 1,550 x 1,800 |
1,200 x 1,550 x 1,800 |
| Weight |
kg |
Approx. 2,300 |
Approx. 1,750 |
* Click the equipment photo to open the product catalog (PDF).
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Equipment for stealth dicing |
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DFL7341 |
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| Max. Workpiece size |
mm |
ø200 |
| Processing method |
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Fully automatic |
| X-axis |
Max. feed speed |
mm/s |
1.0 - 1,000 |
| Y-axis |
Positioning accuracy |
mm |
Within 0.003/210 |
| Utilities |
Dimensions (WxDxH) |
mm |
950 x 1,732 x 1,800 |
| Weight |
kg |
Approx. 1,800 |
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DFL7361 |
DFL7360FH |
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| Max. Workpiece size |
mm |
ø300 |
| Processing method |
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Fully automatic |
| X-axis |
Max. feed speed |
mm/s |
0.1 - 1,000 |
1.0 - 1,000 |
| Y-axis |
Positioning accuracy |
mm |
Within 0.003/310 |
| Utilities |
Dimensions (WxDxH) |
mm |
1,210 x 3,270 x 1,800 |
1,100 x 2,100 x 1,990 |
| Weight |
kg |
Approx. 2,570 |
Approx. 2,090 |
* Click the equipment photo to open the product catalog (PDF).
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Equipment for Laser Lift-off |
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DFL7560L |
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| Max. Workpiece size |
mm |
ø150 |
| Processing method |
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Fully automatic |
| Utilities |
Dimensions (WxDxH) |
mm |
2,000 x 1,810 x 1,800 |
| Weight |
kg |
Approx. 3,300 |
* Please note that if you perform Laser Lift-off (LLO) processing, you may infringe
Japanese Patent No. 4258776 or its corresponding foreign patents.
* Click the equipment photo to open the product catalog (PDF).
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The above specifications may change due to technical modifications. Please confirm when placing your order.
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