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Applications Example


Reducing wafer edge chipping by optimizing the fine grinding amount
 

Wafer edge chipping can lead to poor wafer strength and breakage. By optimizing the amount ground during fine grinding, it is possible to remove the large chipping generated during rough grinding.

Low fine grinding amount Optimized fine grinding amount
Low fine grinding amount
The chipping generated during rough grinding remains
Optimized fine grinding amount
The chipping generated during rough grinding is removed

Optimizing the fine grinding amount reduces both the size and amount of chipping.

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