Japanese Chinese Traditional Chinese Simplified Korean English
About DISCO Investors CSR
HomeNews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
DISCO HOME > Solutions > Applications Example > Grinding


Applications Example

High Quality Processing of InP (Indium Phosphide)
Optimization of wheels and processing parameters enables high quality processing of InP (indium phosphide) used in high-speed devices.
Selection of optical processing parameters improves the condition of the processed surface compared with the existing method.
Before the improvement After the improvement
改善前の加工面 改善後の加工面
Figure 1: Microscope Images of the Processed Surface
Reference: Surface Roughness after Processing a 3-inch InP Wafer
(After Optimizing the Processing Parameters)
Surface roughness Ra: 0.004 µm
Surface roughness Ry: 0.033 µm

Kiru, Kezuru, Migaku Topics
Applications Example
DISCO Technical Review
Solutions Support

KABRA Used semiconductor equipment
Personal Information Protection Policy
User Agreement
Use of the DISCO Corporate Name
Guarantee policy for customer using DISCO Products
Back To Top