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Applications Example


CP alignment    

CP alignment (Characteristic point alignment) is the function which recognizes the target based on its profile and conducts matching. This is effective when alignment is difficult by the conventional method which recognizes the target based on the contrast.

Examples
Example 1:
Workpiece in which sufficient contrast cannot be obtained by light level adjustment
(Reference photographs: Si 300 µm thick + Si 300 µm thick bonded wafer)
Currently CP alignment
Currently
Target cannot be recognized due to insufficient contrast
CP alignment
Target can be recognized
Example 2:
Workpiece with many scratches and foreign matter on the target
(Reference photographs: Terminal on a package substrate)
Currently CP alignment
Currently
Target cannot be recognized due to roughness and scratches
CP alignment
Target can be recognized
<Caution>
As shown below, depending on the condition of the scratches and foreign matter, there is a case where alignment may be unstable.
Target can be recognized Target recognition is unstable

There is a scratch/foreign matter inside the target

There is a scratch/foreign matter on the target profile

This function can be installed as a user-specified specification. For details, contact your DISCO sales representative.

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