Adopting the newly developed resin bond enables reducing edge chipping and grinding damage which are problems in thin wafer grinding. The BT100 bond emphasizing quality and the BT300 bond emphasizing wheel life are available to offer a selection suitable for various needs.
Newly developed resin bond offers ultra-high grinding quality.
New wheel base (GF01) offers highly effective delivery of
The BT100 emphasizing quality and the BT300 emphasizing wheel life are available.
For the detailed specification and functions, view our catalogues.