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DISCO HOME > News Releases > Event Schedule > SEMICON Japan 2012
Booth Map
This event is now over.
Thank you very much for taking the time to visit the DISCO booth.
What's New
Exhibition Information
  • Latest stealth dicing technology
  • Latest ablation processing technologies
  • Laser processing of non-silicon materials such as sapphire, glass and GaN
  • Introduction to SiC wafer processing
  • Ultrasonic-wave dicing sample exhibit
  • TAIKO wafer exhibit
  • Thinned wafers and thinning wheels exhibit
  • Introduction to the latest DBG process
  • Resin grinding wheels and ground wafer exhibit
  • BG tape surface planarization sample exhibit
  • LED phosphor resin planarization sample exhibit
  • Bump planarization sample exhibit
  • Ultrasonic-wave dicing
  • Ultrasonic-wave Charging Unit
  • Dicing saw lineup
  • Dicing blade lineup
  • Feel free to ask us about our dicing and grinding service.
Note: Please note that the exhibits may change without notice.
SEMICON Japan 2012


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