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Thick Wafer Dicing Using Blade Dicing Saws

Application processing examples

Although blade dicing saws are generally used to singulate wafers, they are also able to process thick substrates when installed with a user-specified specification. DISCO responds to customers’ varied needs with customized solutions by utilizing the manufacturing technology of its equipment and consumables.


Processing Examples

Soda-lime Glass

The following is a photograph of 60 mm deep grooving into a soda-lime glass block using a blade dicing saw.

Processing Example
Sample Size(WxDxT) :40x15x70 mm
Cutting Depth : 60 mm

Carbon

The following is a photograph of 67 mm deep grooving into a carbon block using a blade dicing saw.

Processing Example
Sample Size (WxDxT): 40x50x90 mm
Cutting Depth : 67 mm

Ceramic

The following is a photograph of 49 mm deep grooving into a ceramic block using a blade dicing saw.

Processing Example
Sample Size(WxDxT) :50x50x50 mm
Cutting Depth : 49 mm

Contact

Please feel free to contact us with any questions or inquiries.

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