Dicing saws are machines that use blades to cut workpieces made of materials such as silicon, glass, and ceramics with high precision. Generally called a "slicer."
Laser saws are machines that use laser light characteristics to achieve a high-speed, high-quality, precision processing. There are two major processing methods: Ablation and stealth dicing.
Grinders are machines that thin or flatten materials while polishers are machines that polish materials to relieve stress or achieve mirrored surfaces.
Surface planers are machines that use diamond bits to achieve high-precision flattening of materials. It is suitable for processing ductile materials such as Cu, solder, and resins.
Die separators are machines that separate workpieces with high-precision after laser stealth dicing or DAF (Die Attach Film), which is indispensable for stacking thin chips.
Wafer mounters are machines with an all-in-one mechanism, which enables UV irradiation on surface protection tapes, DAF（Die Attach Film） attachment, dicing frame mounting, and surface protection tape delamination.
Waterjet saws are machines that cut workpieces with abrasive materials discharged from a nozzle together with pressurized water. It is suitable for curve cutting and heat-sensitive materials.
Introduction to peripheral equipment that is used together with dicing saws and grinders to achieve more precise and stable processing results.
Dicing blades are consumables used on dicing saws to cut or groove a variety of workpieces including silicon wafers.
Grinding wheels are consumables used on grinders to thin or flatten a variety of workpieces including silicon wafers.
Dry polishing wheels are consumables used on polishers to improve the durability of wafers by removing damaged layers (stress relief) after backgrinding.
Introduction to wheel coolant additives that can improve processing quality and related products (various cassettes, frames, etc.) necessary for using precision processing equipment.
Cut-off wheels are consumable used to cut a variety of materials such as special steel, ceramics, glass, etc.
Dicing Before Grinding
Process in which thinning and die separation are performed simultaneously by first conducting grooving on the wafer using a dicing saw and then backgrinding
Stealth Dicing Before Grinding
Process that forms high-strength, thin die through backgrinding and tape expansion after the SD layer is formed in the wafer
Process that dices wafers that include low-K material with low mechanical strength used as insulating film for LSI devices
Process that planarizes ductile materials, such as metal and resin, using a diamond bit
Singulation process with high processing performance that adds ultrasonic vibration to the standard blade dicing process
Process that forms an SD layer using a focused laser beam and separates die using tape expansion
Process that improves handling for thin wafers without using secondary materials by leaving the edge and only backgrinding the inner section of the wafer
Process that slices wafers by forming a separation layer using laser irradiation from the front side of the SiC ingot