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Applications Example

Thickness control by using NCG
NCG is The Non Contact Gauge.

DISCO's Fully Automatic Grinder and Grinder/Polisher usually measure wafer thickness in grinding process and control wafer thickness by contact gauge. NCG measure wafer thickness without contact, and has advantage below.

<Avoidance wafer breakage risk by the thickness measurement>
NCG avoid the risk of breaking wafer which is weak in load, for example the cavity configuration or a wafer ultrathinning. In the case of grinding such wafers, measuring thickness by the contact gauge itself makes risk of braking by the contact gauge.
<Good evaluation of thickness variation between wafers>
Because NCG measure only the Silicon thickness, it is possible to decrease Silicon thickness variation, caused by the tape differences or the thickness variation of a hard substrate.

Measurement in grinding process (Height gauge and NCG)
Fig.1 Measurement in grinding process (Contact gauge and NCG)

Advantage.1: Wafer break risk reduction
Fig.2 Example of brakage by contact gauge

Advantage.2: Good evaluation of thickness variation between wafers
Fig.3 Measurement process Contact gauge and NCG

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