Higher quality processing is now possible for 4-inch LT wafers used in SAW device substrates and other components.
Surface Roughness Data
The surface roughness values are approximately Ra: 0.002 µm, and Ry: 0.017 µm.
Surface After Processing
Conventional processed surface
High-quality processed surface
The amount of the wheel wear is about 2µm during about four minutes per 10µm amount of grinding in the processing time of 4-inch LT wafer.
Moreover, processing results of 30 µm amount ground and 110µm final thickness have been achieved.