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DISCO HOME > Solutions > Applications Example > Grinding


Applications Example

High-Quality Grinding of Lithium Tantalate
Processing Example
Higher quality processing is now possible for 4-inch LT wafers used in SAW device substrates and other components.

Surface Roughness Data
The surface roughness values are approximately Ra: 0.002 µm, and Ry: 0.017 µm.
Surface After Processing
Conventional processed surface
Conventional processed surface
High-quality processed surface
High-quality processed surface
Process Results
The amount of the wheel wear is about 2µm during about four minutes per 10µm amount of grinding in the processing time of 4-inch LT wafer.
Moreover, processing results of 30 ┬Ám amount ground and 110µm final thickness have been achieved.

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