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Applications Example

GaAs Wafer Thinning with Tape Securing Process
Typically, GaAs wafers are secured with wax, but based on the application, tape securing for grinding is also possible.

Processing examples
GaAs is an easily damaged material, so typically wax securing is chosen for grinding due to its strong retaining force. However, if the wheel, processing conditions, tape, and other variables are chosen properly, tape secured grinding is also possible.

Wax securing process
  • Low risk of wafer breakage during grinding.
  • High probability of variation in thickness due to difficulty in precisely applying wax.
  • A cleaning step is necessary to remove the wax after peeling and grinding.
  • High risk of wafer breakage during cleaning.

Tape securing process
  • Process is simple when compared with wax securing.
  • Low probability of variation in thickness due to high precision securing method.
  • High risk of wafer breakage when grinding if suitable conditions are not selected.

Figure 1: Wax securing and tape securing process comparison

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