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DISCO HOME > Solutions > Applications Example > Grinding


Applications Example

6-inch GaAs Wafer Thinning when it is Secured with Tape
The results of our thinning process of 6-inch GaAs wafers affixed with tape will be introduced.

Processing Example
A 90 µm finish could be realized without any problem when a 6-inch GaAs wafer was processed after being secured with tape. Its handling did not produce any problem. The wheels used were #600 and #4800 for rough and finish grinding respectively.

Surface roughness (after finish grinding)

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