Japanese Chinese Traditional Chinese Simplified Korean English
About DISCO Investors CSR
HomeNews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
DISCO HOME > Solutions > Applications Example > Dicing


Applications Example

SiC Dicing using the ZP Blade
When processing an SiC (silicon carbide) workpiece using a conventional electroformed blade, the blade tends to be glazed because this material is very hard. Such blade condition may cause chipping or cracking of the workpiece or blade breakage. The ZP blade, on the other hand, can demonstrate the excellent cutting ability for SiC, specific to the electroformed bond, while maintaining an adequate self-sharpening performance, because pores are formed in the bond. This makes it possible to simultaneously provide a high level of continuous processability and process quality when dicing SiC.

Process Example
Use of the ZP blade greatly improves the backside chipping condition.

Photo 1:
Backside when processed with the ZP blade
Photo 2:
Backside when processed with the Z blade

Kiru, Kezuru, Migaku Topics
Applications Example
DISCO Technical Review
Solutions Support

KABRA Used semiconductor equipment
Personal Information Protection Policy
User Agreement
Use of the DISCO Corporate Name
Guarantee policy for customer using DISCO Products
Back To Top