Japanese Chinese Traditional Chinese Simplified Korean English
About DISCO Investors CSR
HomeNews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
DISCO HOME > Solutions > Applications Example > Dicing


Applications Example

Profiling using a dicing saw 5
The dicing saw is normally used to cut a workpiece into die, but it can also perform profiling by utilizing the shape of the blade.

Process Example
The photograph shows the result when grooving silicon (Si) into pillars 1 µm square with a height of 30 µm.
This can be realized only when the machine operation is highly accurate and process damage caused by the blade is at its minimum.
Profile processing can be used when producing microparts and testing samples.

Fig. 1 Grooving

Kiru, Kezuru, Migaku Topics
Applications Example
DISCO Technical Review
Solutions Support

KABRA Used semiconductor equipment
Personal Information Protection Policy
User Agreement
Use of the DISCO Corporate Name
Guarantee policy for customer using DISCO Products
Back To Top