DISCO
Japanese Chinese Traditional Chinese Simplified Korean English
SiteMap
About DISCO Investors CSR
HomeNews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
DISCO HOME > Solutions > Applications Example > Dicing

Solutions


Applications Example


Process using the 3-point edge alignment
 
Edge alignment is the process where the workpiece edge is detected and the cutting points are calculated based on that edge.
3-point edge alignment process details
Workpiece position deviation from the chuck table center is detected by calculating the center position and the diameter of 3 edge points of the round workpiece. That information is reflected to the X and Y axes cut limits.
Example of the process using the 3-point edge alignment
1. Countermeasure for flying triangular die (cut completion point correction software)
This process stops cutting short of the wafer outer edge to suppress the generation of the triangular die (edge material).
It becomes possible to set the cut completion position at a precise point by recognizing the exact placement position and diameter of the wafer.
2. Countermeasure for tape damage during laser processing
When the tape area outside the workpiece is irradiated during laser processing, holes are opened in the tape from which the vacuum leaks. By using edge alignment that recognizes the workpiece diameter and placement on the chuck table, it is possible to avoid the laser irradiation of the tape.
  Solutions

Kiru, Kezuru, Migaku Topics
 
 
Applications Example
 
 
DISCO Technical Review
 
 
Solutions Support
 
 

KABRA Used semiconductor equipment
Personal Information Protection Policy
User Agreement
Use of the DISCO Corporate Name
Guarantee policy for customer using DISCO Products
Back To Top