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DISCO HOME > Solutions > Applications Example > Dicing

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Applications Example


The process of ring removal for TAIKO wafer by circle cutting
 
Up until now a process called ring grinding has been used to remove the ring left over from TAIKO grinding. We have now developed a process of ring removal by circle cutting with a blade dicer.


Advantages of ring removal by circle cutting
- A simplified process with less tape mounting compared to the ring grinding process
- Frame handling reduces the risk of breakage when handling thin wafers


Introduction to the TAIKO ring removal process

For details, please contact the Application R&D Division.
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