Japanese Chinese Traditional Chinese Simplified Korean English
About DISCO Investors CSR
HomeNews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
DISCO HOME > Solutions > Applications Example > Dicing


Applications Example

The process of ring removal for TAIKO wafer by circle cutting
Up until now a process called ring grinding has been used to remove the ring left over from TAIKO grinding. We have now developed a process of ring removal by circle cutting with a blade dicer.

Advantages of ring removal by circle cutting
- A simplified process with less tape mounting compared to the ring grinding process
- Frame handling reduces the risk of breakage when handling thin wafers

Introduction to the TAIKO ring removal process

For details, please contact the Application R&D Division.

Kiru, Kezuru, Migaku Topics
Applications Example
DISCO Technical Review
Solutions Support

KABRA Used semiconductor equipment
Personal Information Protection Policy
User Agreement
Use of the DISCO Corporate Name
Guarantee policy for customer using DISCO Products
Back To Top