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Applications Example


Measures to prevent bonding pad corrosion
 
During long cutting processes, such as processing large-diameter wafers or workpieces with small-sized die, prolonged water exposure to the workpiece surface can cause corrosion* of the metallic areas of the bonding pads, thus causing potential difficulties during the wire bonding process.
*Corrosion: Rusting caused by a chemical reaction
Practical Example
Using the additive agent StayClean-F with dicing water forms an ultra-thin barrier layer which prevents corrosion as shown in the below photographs.
DI water only
When using StayClean-F
Reference Information
Wafer edge chipping countermeasure
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