UltraPoligrind employs a super-fine diamond abrasive to create higher die strength
and enable grinding with even less damage than Poligrind. This new finish grinding wheel is also able to maintain
a gettering effect, which is often removed when a stress relief process is used. It is a chemical-free normal
grinding process resulting in a low environmental impact, and allows wafer thinning grinding with ease of operation.
High die strength with little damage to wafers
Maintains the same gettering performance as normal grinding
For the detailed specification and functions, view our catalogues.