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Automatic Cleaning System

The spinner unit cleans semiconductor wafers, glass, ceramics, and a wide variety of other workpieces. Appropriate for use with automatic dicing saws and other machines that lack a cleaning function, the unit offers cleaning with water, rinsing with user-specified chemicals (option), and drying.

DCS1440 Catalog
DCS1460 Catalog
Discontinued Machines
Maximum workpiece ø8"/250mm square ø300mm/310mm square ø8"
Supported frames DTF2-5, DTF2-6, DTF2-6-1, DTF2-8-1, DTF2-5-1* DTF2-8-1, DTF2-12, DTF2-12-1, (DTF2-5, DTF2-5-1, DTF2-6, DTF2-6-1)* 2-5, 2-6, 2-8
Cleaning methods High-pressure cleaning specification, Atomizing cleaning nozzle specification* High-pressure cleaning specification
Table roating speed range
100 - 3,000 0 - 3,000
Spinner discharge pressure (MPa) 2.0 - 11.8 2.0 - 12.0
Machine dimensions (WxDxH)
400 x 600 x 1,220
(excludes lamp tower and touch panel)
500 x 650 x 1,220
(excludes lamp tower and touch panel)
400 x 719 x 1,220
(excludes lamp tower)
Machine weight (kg) About 130 (with transformer for overseas use: About 164) About 150 (with transformer for overseas use: About 184) About 150 (with transformer for overseas use: About 170)
Features Double-arm cleaning can be installed as an option, and the cleaning function has been improved. In addition, it was designed to be environmentally-friendly in accordance with green procurement and RoHS. Designed to complement 300 Series dicing saws, DCS141 has a small footprint and overall size and is easy to operate.
* Option specification
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