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December 2, 2014

Introducing the DCS1441, an automatic cleaning unit with enhanced cleaning performance

DISCO Corporation (Head office: Ota-ku, Tokyo; President: Kazuma Sekiya) has developed the DCS1441, a new addition to our lineup for automatic cleaning system with ø8-inch wafer support. The DCS1441 offers improved cleaning performance and enhanced usability to meet the ever growing demand for high wafer cleanliness from our customers.
This unit will be on display at SEMICON Japan 2014 (Dec. 3 to 5 at the Tokyo Big Sight).

Development background
As the market expands due to demand for smartphones and tablets, the demand for image sensors and other electronic parts, which require high wafer cleanliness, is also expanding accordingly. Alternatively, there also many cases where manufacturers add cleaning processes after the dicing step to reduce the occurrence of die defects caused by the adhesion of contaminants to wafers. The new DCS1441 is an automatic cleaning unit which meets these needs with its high cleaning performance.
Product Characteristics
  • Automatic cleaning unit with ø8-inch wafer support
    - Supports a maximum workpiece size of □210mm
  • High cleaning performance
    - Cleaning arm with variable speed support (for optimized cleaning)
    - Newly added support for high performance atomizing nozzle specification as an option for image sensors and other applications requiring a high degree of cleanliness.
    - A DI water circulation unit available as an option to circulate and reuse the DI water within the DCS1441 for stable cleaning quality.
  • Improved usability
    - Addition of a simplified settings mode which only requires workpiece size table rotation, and cleaning time parameters to start the cleaning process.
    - Change in the position of the LCD for easier operation.

June 2015: Release

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