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Press Release

November 10, 2014

Introducing the DAD323, the world’s smallest footprint*1 automatic dicing saw*2 with expanded functionality

DISCO Corporation (Head office: Ota-ku, Tokyo; President: Kazuma Sekiya) has developed the DAD323, automatic dicing saw for ø6-inch wafers. The compact design of the DAD323, which is only 490 mm wide, is combined with improved axis speed for improved throughput to offer our customers expanded productivity.
This unit will be on display at SEMICON Japan 2014 (Dec. 3 to 5 at the Tokyo Big Sight).

Development background
Recent years have seen significant growth in the need for dicing equipment capable of cutting LEDs and electrical components in Asian markets, led primarily by China. For Asian markets, with demands for high productivity, DISCO has focused on offering low price and space-saving designs, which culminated in the development of the 32X series of dicing saws, which was represented by the DAD322. The 32X series saws are dicing saws with a proven track record with over 5500 units sold worldwide.
The newest entry into the 32X series is the DAD323 offering improved throughput and equipment usability in addition the world’s smallest footprint to respond to our customers’ demands for further increases in productivity and expanded applications for everything from semiconductor wafers to electronic parts.
Product Characteristics
Automatic dicing saw for ø6-inch wafers
- 150 mm square workpiece support can be added via a user-specified specification.
Offering the world’s smallest space-saving footprint
- W: 490 mm D: 870 mm H: 1,600 mm
- This advantage is especially apparent when multiple units are used in parallel (improved productivity per unit area).
Improved throughput
- Improved speed for the X, Y, and Z-axis.
・ Maximum speed of the X-axis improved to 700 m/s (Increased by about 1.4x compared to the existing DAD322).

◆Comparison of max return speed for each axis (mm/s)
DAD322
(Current unit)
DAD323
(New unit)
X-axis 500 700
Y-axis 150 170
Z-axis 30 80

- Incorporation of a high performance processor
・ Screen transition time and software operation speed have been greatly improved.
High torque 2.0 kW spindle installed
- Supports the processing of difficult-to-cut materials including glass and ceramics
- A high rotation speed 1.8 kW spindle is also available as an option (max rotation speed: 60,000 min-1).
Further evolution for improved user friendliness
- Increased operation monitor size (Current: 10.4 inches →15 inches) for improved visual recognition and an increase in the amount of displayable information.
- Unification of the operating system with the more advanced 3000 series.
◆Operation monitor size comparison
Scheduled release date

June 2015

First year sales target

Sales forecast of 200 units

*1: According research by DISCO Corporation (as of Nov 1st, 2014)
*2: Automatic dicing saw: The workpiece is placed on and removed from the chuck table by hand, and only the cutting sequence is automatic.
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