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November 21, 2011

New Addition to the Stealth Dicing Laser Saws for 300 mm Wafers
Introducing the DFL7360FH with Ring Frame Handling Specification

DISCO Corporation (Head Office: Ota-ku, Tokyo, President: Kazuma Sekiya) has developed the DFL7360FH, with ring frame handling specification, for our stealth dicing (SD) engine laser saw series to handle 300 mm wafers.
*What is stealth dicing?
Stealth dicing is a dicing technology that forms a modified layer at a selectable location by focusing the laser beam inside of the workpiece and applies external stress such as tape expansion, thereby growing a fissure inside the workpiece surface into singulated die. Highly accurate and stable processing has now been realized thanks to the collaboration between the dicing technology developed by DISCO and SD engine developed by Hamamatsu Photonics K.K. exclusively for DISCO.
Development Background
In 2007, DISCO introduced the DFL7340 for 8-inch wafers and the DFL7360, a model for frameless 300 mm wafers as stealth dicing laser saws effective for devices which are easily affected by water and stress. Now, based on the forecast of increasing needs for 300 mm wafers in future, such as the start of production using 300 mm wafers for thin and small die devices, such as IC tags and line sensors, mainly using 6" and 8" wafers in the production, DISCO is introducing the DFL7360FH having the ring frame specification for 300 mm wafers to increase your equipment choices.
Features of the DFL7360FH

  • Stealth dicing equipment for 300 mm wafers DFL7360FH
  • Demonstrates high street reduction
    - Stealth Dicing allows the maximization of the number of die per wafer through the minimization of the required street width.
  • Use of ring frame handling
    - Replacement of conventional blade dicing saws is relatively easy. In addition, delivery to before and after processes, such as the mounter and the die bonder, is also smooth.
    Launch timing
    Now on sale
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