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Press Release

November 17, 2011

Introducing the DFD6560: Ultra-compact Fully Automatic Dicing Saw for 300 mm wafers

DISCO Corporation (Headquarters: Ota-ku, Tokyo, President: Kazuma Sekiya) has developed the DFD6560. This fully automatic dicing saw for 300 mm wafers will be on display at SEMICON Japan 2011 (from Dec. 7 to 9 at Makuhari Messe).
Background of the Development
In order to meet the needs of 300 mm wafer dicing, which is expected to expand further, DISCO has developed the DFD6560 with emphasis on a small footprint and high throughput.
Features of the DFD6560

  • Small footprint
  • As a result of optimizing the layout inside the equipment in addition to the introduction of the newly developed short spindle, the footprint can be reduced by 16% from our conventional model DFD6362.
    Concentrating the maintenance area to the front eliminates having maintenance areas at both right and left sides.
  • High throughput
  • With the introduction of the newly developed thin wheel cover, the distance between blades on the facing dual spindles has been shortened. This increases the number of lines that can be cut simultaneously, so that the cut time can be shortened by a maximum of about 10%*.
    *Actual reduction varies depending on the processing parameters.
    Future plans
    SEMICON Japan 2011 : December 2011
    Test cut start (scheduled) : May 2012
    Start of high volume production : October 2012
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