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Press Release

November 24, 2010

Introducing the DAD3240, Automatic Dicing Saw for φ8" Wafers with the Width of only 650 mm

DISCO Corporation (headquarters: Ota-ku, Tokyo, President: Kazuma Sekiya) has newly developed the DAD3240, automatic dicing saw for φ8-inch wafers.
This equipment will be exhibited in SEMICON Japan 2010 (from December 1 to 3 at Makuhari Messe).

Development Background
DISCO has pursued simplification, compactness and improved usability of automatic dicing saws for φ8-inch workpieces (8-inch square workpieces*) and newly developed the DAD3240.

* Separate dedicate jig is necessary.
Features of the DAD3240

Pursuit of user-friendliness

  • Equipped as standard with the auto alignment function, which has an established reputation in the DAD3000 series
  • Realizing intuitive operation through 15" LCD touch panel and GUI
  • Adopting the operating system, which has been favorably evaluated in the DAD3000 series, so that not only the existing customers but also new customers can operate the equipment easily.

Compact design

  • Width is merely 650 mm for φ8-inch wafers
  • Two-thirds of the DAD3350* footprint
    *DISCO existing automatic dicing saw for ΓΈ8-inch wafers

High processability

  • Use of a high power 1.8 kW spindle enables processing various materials from silicon to hard and brittle materials such as ceramics

Reduced maintenance frequency

  • Microscope lens shutter and scope blow function installation reduces the frequency of microscope maintenance so that improvement of equipment work efficiency can be expected.

Design in consideration of environment

  • Eliminates 15 substances, including 6 substances specified by EU RoHS Directives

Exhibiting at SEMICON Japan 2010


December 2010

Start of mass-production


February 2011

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