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Press Release

November 16, 2010

Introducing the ZHDG Electroformed Hub Blade Series for High Quality LED Board Cutting

DISCO Corporation (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya) has newly developed the ZHDG electroformed hub blade series that can realize high-grade cutting of chip LED boards and various semiconductor packages. This product will be exhibited at SEMICON Japan 2010 to be held in December.

Development Background and Advantages
The ZHDG series consists of electroformed blades*1 having a hub and that have been developed to process workpieces with metal electrodes, such as chip LED boards, and various semiconductor packages including ceramics and BGA (ball grid array).
The abrasive grains used are larger than the conventional hub blades for semiconductor wafers and a wide range of concentration*2 is available. These advantages enable selecting blades suitable to the workpiece characteristics.

*1 Electroformed blades: Dicing blades formed by plating
*2 Concentration: A value showing the proportion of diamond abrasive grains contained in the blade
Product Details

<Reduces burring>

The ZHDG uses diamond abrasive grains larger than those used in general blades for silicon wafers. Thanks to this feature, the cutting performance of this new blade series does not deteriorate even after processing cohesive materials, such as metal or resin, so that burring can be reduced.

<Good balance between processing quality and blade life>

Seven grit sizes and four types of concentration are available. The selectable blades are well balanced between quality and life.

Graphs based on concentration (Grit size: #700):


Unveiling at SEMICON Japan 2010


December 2010

Sample delivery start (scheduled)


January 2011

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