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DISCO HOME > News Releases > Event Schedule > SEMICON Japan 2010
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SEMICON Japan 2011 ended its three days session on Friday, December 9, 2011.
This year again, thanks to you, the show was well-attended and was a great success. We would like to express our heartfelt appreciation to you for taking time to visit DISCO booth among many other booths on site.Thank you very much.
We will continue striving to develop our "Kiru, Kezuru and Migaku" technologies in order to provide true satisfaction to the customers. Your continued support and patronage will be greatly appreciated.
What's New
Exhibition Information
Stealth dicing
Ablation processing
Laser processing of non-silicon materials such as SiC, glass and sapphire
Exhibit of thinning wheels and thinned wafers
Introduction of the latest DBG process information
Introduction to tape cutting applications
Introducing the relationship between DISCO’s technology and TSV/BSI process
Exhibit of TSV sample wafers
LED process solutions
TAIKO process
Sic wafer grinding and polishing processes
Dicing saw lineup
Dicing blade lineup
Flattening of LED prosperous resin
Bump flattening
Ultrasonic wave dicing
Ultrasonic wave grinding
Recycling of deionized dicing drain water
Other exhibits related to energy conservation products and related technology
We can accept any consultation for cutting and grinding consignment processing.
Note: Please note that the exhibits may change without notice.
SEMICON Japan 2010


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