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DISCO HOME > Laser Dicing Solutions > DISCO Laser Features > DISCO's Strength

Laser Dicing Solutions

DISCO's Strength

Variation of laser oscillators
  • DISCO makes the proposal best suitable for your processing needs from the lineup of various oscillators with different output, frequency width and pulse width.
  • Originally developed optical system.
  • Dicing engine developed by Hamamatsu Photonics.
    - The stealth dicing engine developed for DISCO under the license agreement by Hamamatsu Photonics, which is well known for its highly sophisticated optics related technology, is installed.
Organization to develop application
  • In order to develop applications best suitable for customer needs in a timely manner, DISCO has competent staff and advanced facilities in place.
    Please feel free to contact us.
    - About 100 laser dedicated engineers
    - About 10 laser equipment for test cutting
    - About 100 laser oscillators for test cutting
    - About 480 annual test cuts (in 2009)
  • Sold more than 200 laser saws worldwide (as of January 2010).
    Many of the world’s leading semiconductor production facilities.
    (e.g., major semiconductor and LED manufacturers, universities and research laboratories) use DISCO laser saws.
  • Reliable mechatronics cultivated through our blade dicing saws and grinders which proudly occupy a 70% share in the global market.
Product supply speed
  • Close relationship between R&D and production divisions realizes speedy product delivery.
  • DISCO can cope with the urgent startup of production line.
Worldwide support system
  • Engineers are constantly present at 48 locations in 15 countries.
    Speedy response is ensured, while collaborating with the Tokyo Head Office, from equipment installation to after sales follow-up.
  • For details, click here.
Laser Dicing Solutions

Applications Support
Dicing and Grinding Service
Personal Information Protection Policy
User Agreement
Use of the DISCO Corporate Name
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